Electronic-Cover

Material for the creation of e-passport covers containing certain number of contactless electronic circuit (or chip) modules with antenna, designed for production of ID documents in the form of booklet (ID3 format) and further storage of biometric data on the chip.
For the production of e-cover, Industrial Innovation Group uses various cover materials and chips of the latest generation, which comply with international standards ISO and ICAO.
Materials, thickness, dimensions, layout (layout) are carefully selected depending on the requirements for the final product.